UNIT - 3

SoC & Interconnect

Q1) Write and explain signal integrity issues in detail.

Q2) Explain the following terms:

a)     Clock Jitter

b)    Clock Skew

Q3) Draw and explain I/O architecture.

Q4) What is PAD design? Why it is needed?

Q5) Write the function for all pad driver circuitry.

Q6) What are interconnect routing techniques? Explain.

Q7) Why power optimization is needed?

Q8) Write short note on:

a)     Technology Scaling

b)    Run power

Q9) What is the Power saving techniques? Why they are used?

Q10) What is the use of supply and ground bounce?

Q11) Write and explain the types of power distribution techniques in detail.

Q12) Write and explain the types of Clock Jitter.